Cracks and crevices
Monitoring during and after completion of the thermal insulation and air exchange through cracks and crevices (infiltration) are determining factors for the energy use of a building in the use phase. With the increasing insulation of the building envelope increasing the negative impact of any imperfections far. Too small a thermal quality of the building shell can include fungal attack have the effect on the inside of the structure. Air leaks in the building envelope can cause draft problems, building damage, (eg by internal condensation), and a moist indoor environment (eg air leaks in the ground floor).
Not every damp wall is caused by a ruptured pipe. Rising damp or penetrating water due to the poor implementation of rain and drain flushing water can cause damp walls. Moisture damage can also be caused by clogged pipes or insufficient flow. It is important that the cause of rising damp or water precipitation at the earliest possible stage is found with a thermal imager. This will prevent the damage will further expand.
Thermal bridges, connecting the outer surface (wall, roof or floor) of a house / building, are energy wasters. In places of thermal bridges, moisture may condense from the air. As a result, there develops fungal growth on these sites and runs the health of residents / users at greater risk. Thermographic / infrared images provide the necessary information to prevent mold or detect, even in hidden corners and niches of a house / building.